Beplain Mung Bean Milk Peeling Gel (4.05 oz) - Reveal Your Softest Skin

Experience the gentle magic of the beplain Mung Bean Milk Peeling Gel, a dreamy, innovative exfoliator that redefines what a deep clean should feel like. This isn't the harsh, stripping scrub you might be used to; it is a soft, comforting gel enriched with Mung Bean Milk, a traditional Korean skincare secret rich in protein and moisture. The gentle formula transforms as you massage it onto your skin, visibly gathering up dead skin cells and impurities into soft "gommage" clumps. It truly provides a thorough exfoliation experience that leaves your skin feeling incredibly soft, smooth, and ready for all the goodness of your subsequent skincare routine.

The real beauty of this gel lies in its commitment to healthy skin: it utilizes four types of Peeling Polymers—a gentle, smart exfoliating ingredient that only reacts with and removes actual dead skin cells and waste on your skin's surface. Unlike harsh physical scrubs, this polymer-based peeling process is proven to be dermatologically non-irritating, making it a fantastic choice for all skin types, including sensitive skin. This mild yet effective action ensures that while dead skin is removed, your skin's vital moisture barrier is simultaneously strengthened and nourished, thanks to the protein-rich Mung Bean Soy Milk. Your complexion will feel nurtured rather than stripped, looking naturally more radiant.

This peeling gel is the perfect foundation for a flawless makeup day, offering a proven 184% improvement in makeup longevity after just one use. It works its smoothing magic on both wet and dry skin, giving you the freedom and convenience to fit exfoliation into any part of your self-care ritual. It’s a 100% Vegan recipe that also contains gentle yet effective exfoliating acids like Capryloyl Salicylic Acid and Gluconolactone (PHA) to further refine texture and brighten your complexion. Make this gel your once or twice-weekly ritual to reveal a vibrant, healthy canvas that is ready to glow.