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Embedded Dielectrics for Electronic Packaging - by Shuhui Yu & Rong Sun & Ching Ping Wong (Hardcover)

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about this item

This book provides an overview of nanocomposite materials that can be used as embedded dielectric layer in high-density electronic packaging, for decoupling, filtering, energy storage or electrostatic discharge suppressing etc. Some fundamental models used to analyze or predict the dielectric behavior of ceramic/polymer, conductor/polymer, and semiconductor/polymer composites are reviewed. This book also introduces design and synthesis of some novel hybrid filler particles, as well as graft modification on the polymer matrix to improve dielectric performance.
Number of Pages: 300
Genre: Technology
Format: Hardcover
Publisher: World Scientific Pub Co Inc
Author: Shuhui Yu & Rong Sun & Ching Ping Wong
Language: English
Street Date: September 4, 2018
TCIN: 52262856
UPC: 9789814619417
Item Number (DPCI): 248-44-7330

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