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Heat Management in Integrated Circuits : On-chip and System-level Monitoring and Cooling (Hardcover)

Heat Management in Integrated Circuits : On-chip and System-level Monitoring and Cooling (Hardcover) - image 1 of 1

About this item

Heat Management in Integrated Circuits focuses on devices and materials that are intimately integrated on-chip (as opposed to in package or on-board) for the purposes of thermal monitoring and thermal management, i.e., cooling. The devices and circuits cover various designs used for the purpose of converting temperature to a digital measurement, heat to electricity, and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. The book includes fundamental operating principles that touch upon physics of materials that are used to construct sensing, harvesting, and cooling devices, which will be followed by circuit and system design aspects that enable successful functioning of these devices as an on-chip system. Finally, the author discusses the use of these devices and systems for thermal management and the role they play in enabling energy-efficient and sustainable high performance computing systems.
Number of Pages: 253
Genre: Technology, Computers + Internet
Sub-Genre: Computer Engineering, Electronics / Circuits / Integrated
Series Title: Materials, Circuits and Devices
Format: Hardcover
Publisher: Stylus Pub Llc
Author: Seda Ogrenci-memik
Language: English
Street Date: December 21, 2015
TCIN: 23938272
UPC: 9781849199346
Item Number (DPCI): 247-49-8408
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$166.25
MSRPReg: $175.00 Save $8.75 (5% off)
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