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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Joint Interfaces
About this item
This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behaviors of lead-free solder joints under different loading conditions. The fracture behaviors of lead-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behaviors of lead-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.
Genre: Science, Technology
Sub-Genre: Material Science, Mechanics / General
Series Title: Springer Theses
Publisher: Springer Verlag
Author: Qingke Zhang
Street Date: November 16, 2015
Item Number (DPCI): 248-17-2041
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