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Packaging of High Power Semiconductor Lasers (Reprint) (Paperback) (Xingsheng Liu)

Packaging of High Power Semiconductor Lasers (Reprint) (Paperback) (Xingsheng Liu) - image 1 of 1

About this item

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
Edition: Reprint
Genre: Technology
Series Title: Micro- and Opto-electronic Materials, Structures, and Systems
Format: Paperback
Publisher: Springer Verlag
Author: Xingsheng Liu
Language: English
Street Date: October 7, 2016
TCIN: 51772888
UPC: 9781493955909
Item Number (DPCI): 248-34-2028
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