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Through Silicon Vias : Materials, Models, Design, and Performance (Hardcover) (Brajesh Kumar Kaushik)

Through Silicon Vias : Materials, Models, Design, and Performance (Hardcover) (Brajesh Kumar Kaushik) - image 1 of 1

About this item

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

Number of Pages: 215
Genre: Science, Technology
Format: Hardcover
Publisher: Taylor & Francis
Author: Brajesh Kumar Kaushik
Language: English
Street Date: August 26, 2016
TCIN: 51735758
UPC: 9781498745529
Item Number (DPCI): 248-32-3019
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$199.95
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