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Microchannel Phase Change Transport Phenomena - by  Sujoy Kumar Saha (Paperback) - 1 of 1

Microchannel Phase Change Transport Phenomena - by Sujoy Kumar Saha (Paperback)

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About this item

Highlights

  • Microchannel Heat transfer is the cooling application of high power density microchips in the CPU system, micropower systems and many other large scale thermal systems requiring effective cooling capacity.This book offers the latest research and recommended models on the microsize cooling system which not only significantly reduces the weight load, but also enhances the capability to remove much greater amount of heat than any of large scale cooling systems.
  • Author(s): Sujoy Kumar Saha
  • 356 Pages
  • Technology & Engineering, Engineering (General)

Description



About the Book



This book offers the latest research and recommended models on the microsized cooling system, which not only significantly reduces the weight load but also enhances the capability to remove a much greater amount of heat than any large-scale cooling systems. A detailed reference to microchannel phase change (boiling and condensation) includes recommended models and correlations for various requirements such as pressure loss and heat transfer coefficient. Researchers, engineers, designers, and students will benefit from the collated, state-of-the-art research that is found in this book and its systematic addressing of the relevant issues and provision of a good reference for solving problems of critical analysis.



Book Synopsis



Microchannel Heat transfer is the cooling application of high power density microchips in the CPU system, micropower systems and many other large scale thermal systems requiring effective cooling capacity.
This book offers the latest research and recommended models on the microsize cooling system which not only significantly reduces the weight load, but also enhances the capability to remove much greater amount of heat than any of large scale cooling systems.

A detailed reference in microchannel phase change (boiling and condensation) including recommended models and correlations for various requirements such as pressure loss, and heat transfer coefficient.

Researchers, engineers, designers and students will benefit from the collated, state-of-the-art of the research put together in this book and its systematic, addressing all the relevant issues and providing a good reference for solving problems of critical analysis.

Dimensions (Overall): 9.0 Inches (H) x 6.0 Inches (W) x .74 Inches (D)
Weight: 1.05 Pounds
Suggested Age: 22 Years and Up
Number of Pages: 356
Genre: Technology & Engineering
Sub-Genre: Engineering (General)
Publisher: Butterworth-Heinemann
Format: Paperback
Author: Sujoy Kumar Saha
Language: English
Street Date: September 29, 2015
TCIN: 1011871009
UPC: 9780128043189
Item Number (DPCI): 247-19-7208
Origin: Made in the USA or Imported
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Shipping details

Estimated ship dimensions: 0.74 inches length x 6 inches width x 9 inches height
Estimated ship weight: 1.05 pounds
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