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Radio Frequency Sputtering - by  Aditya Sharma (Hardcover) - 1 of 1

Radio Frequency Sputtering - by Aditya Sharma (Hardcover)

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Highlights

  • About the Author: Aditya Sharma is an Associate Professor of Physics at UPES, Dehradun, India.
  • 432 Pages
  • Technology & Engineering, Materials Science

Description



From the Back Cover



Fundamental and advanced RF sputtering techniques for thin-film applications

Controlling film thickness, composition, and uniformity remains a persistent challenge in thin-film fabrication. Radio Frequency Sputtering: Thin-Film Deposition and Device Applications covers both fundamental principles and advanced techniques of RF sputtering. Written by researchers from academic and industry laboratories, this reference provides practical guidance for optimizing deposition processes across electronic components, solar cells, and functional coatings.

The book provides step-by-step instructions for RF sputtering processes alongside clear definitions and illustrative examples. Dedicated sections on troubleshooting and process optimization offer targeted advice for overcoming common deposition challenges. Coverage extends to sustainability practices in sputtering operations and examines both established and emerging device applications, connecting process parameters to measurable outcomes in device performance.

Readers will also find:

  • Detailed treatment of RF magnetron sputtering configurations and their influence on film quality across different substrate materials
  • Guidance on controlling deposition parameters to achieve target film thickness, composition, and structural uniformity in production environments
  • Coverage of thin-film applications in semiconductor devices, energy harvesting systems, and advanced functional coatings for diverse industries
  • Discussion of emerging applications including spintronic devices, memory technologies, and materials designed for high-radiation environments
  • Practical frameworks for integrating sustainability considerations into RF sputtering workflows and laboratory or manufacturing operations

Radio Frequency Sputtering serves materials scientists, semiconductor physicists, and engineers working in thin-film fabrication across academic and industrial settings. By connecting deposition fundamentals with device-level outcomes, this reference supports practitioners seeking to optimize RF sputtering processes for both research and production applications.



About the Author



Aditya Sharma is an Associate Professor of Physics at UPES, Dehradun, India. He has held research positions in South Korea and India, with extensive experience in energy harvesting and conversion, thin films, and nanomaterials. Dr. Sharma has guided numerous PhD and MS students throughout his career.

Weon Cheol Lim is a Senior Research Scientist at the Korea Institute of Science and Technology (KIST), Seoul, South Korea. He specializes in thin film deposition using RF magnetron sputtering and ion implantation, focusing on materials reliability in high-radiation environments such as space and nuclear reactors.

Poorva Sharma is an Associate Professor at Luzhou Vocational and Technical College, Luzhou, Sichuan, China. Her research focuses on multifunctional multiferroic materials for advanced spintronic and memory devices. Dr. Sharma has published over 50 scientific papers and has received several prestigious awards.

Jitendra Pal Singh is a Ramanujan Fellow at Manav Rachna University, Faridabad, India, with research positions held in India, Taiwan, and South Korea. His research interests include irradiation studies in nanoferrites, thin films, and magnetic multilayers, contributing to radiation-environment materials science.

Dimensions (Overall): 9.61 Inches (H) x 6.69 Inches (W) x .94 Inches (D)
Weight: 1.95 Pounds
Suggested Age: 22 Years and Up
Number of Pages: 432
Genre: Technology & Engineering
Sub-Genre: Materials Science
Publisher: Wiley-Vch
Theme: Thin Films, Surfaces & Interfaces
Format: Hardcover
Author: Aditya Sharma
Language: English
Street Date: October 23, 2026
TCIN: 1013600919
UPC: 9783527356225
Item Number (DPCI): 247-15-2320
Origin: Made in the USA or Imported
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Estimated ship dimensions: 0.94 inches length x 6.69 inches width x 9.61 inches height
Estimated ship weight: 1.95 pounds
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