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High-Pressure Thermoelastic and Thermophysical Properties of Smart Materials - (Emerging Technologies and Materials in Thermal Engineering)
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Highlights
- High-Pressure Thermoelastic and Thermophysical properties of smart materials: EOSs at High Pressure and Thermal Properties describes how high-pressure research is instrumental in different sectors and how EOS plays an important role in high-pressure research; displays various EOS modelling techniques; explains thermoelastic and thermophysical properties of materials from EOSs, and provides a blueprint of size and shape dependence thermal properties of smart materials.
- Author(s): Anjani Kumar Pandey & Chandra Kumar Dixit & Shivam Srivastava
- 350 Pages
- Technology, Materials Science
- Series Name: Emerging Technologies and Materials in Thermal Engineering
Description
Book Synopsis
High-Pressure Thermoelastic and Thermophysical properties of smart materials: EOSs at High Pressure and Thermal Properties describes how high-pressure research is instrumental in different sectors and how EOS plays an important role in high-pressure research; displays various EOS modelling techniques; explains thermoelastic and thermophysical properties of materials from EOSs, and provides a blueprint of size and shape dependence thermal properties of smart materials. This book opens with an introduction to high-pressure research, surveys experimental and theoretical tools for study at high pressure, covers the role of EOSs to describe thermoelastic properties and their limitations, looks at different modelling techniques of EOSs, considers how extreme-compression behaviour is different from low-compression behaviour, examines thermoelastic properties of smart materials at high pressure, addresses the search of universal EOSs, analyzes the effect of shape and size on thermal properties of smart materials and culminates in future research. This volume provides researchers and academicians working in the field of high-pressure research and shape / size dependent thermal properties a one-stop reference that summates correlations between different aspects of high-pressure thermoelastic and thermophysical properties of advanced materials. It serves as a thorough introduction for less-experienced readers, but also provides a summary of state-of-the-art in the field to physicists, materials scientists and engineers working to exploit high pressure techniques for possible materials development and application.Dimensions (Overall): 9.0 Inches (H) x 6.0 Inches (W)
Weight: .99 Pounds
Suggested Age: 22 Years and Up
Series Title: Emerging Technologies and Materials in Thermal Engineering
Sub-Genre: Materials Science
Genre: Technology
Number of Pages: 350
Publisher: Elsevier
Theme: General
Format: Paperback
Author: Anjani Kumar Pandey & Chandra Kumar Dixit & Shivam Srivastava
Language: English
Street Date: June 1, 2025
TCIN: 1001846117
UPC: 9780443328107
Item Number (DPCI): 247-12-5412
Origin: Made in the USA or Imported
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Shipping details
Estimated ship dimensions: 1 inches length x 6 inches width x 9 inches height
Estimated ship weight: 0.992 pounds
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