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Microelectronic Interconnections and Assembly - (NATO Science) by  George G Harman & Pavel Mach (Hardcover) - 1 of 1

Microelectronic Interconnections and Assembly - (NATO Science) by George G Harman & Pavel Mach (Hardcover)

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About this item

Highlights

  • Preface.
  • Author(s): George G Harman & Pavel Mach
  • 316 Pages
  • Technology, Electronics
  • Series Name: NATO Science

Description



Book Synopsis



Preface. 1. Packaging and Interconnection Trends - Present and Future. 2. Solder and Flip Chip Interconnections and Assembly. 3. Single Chip Interconnection and Qualification: Wire Bonding and TAB. 4. Multichip Module Interconnections and Assembly I. 5. Discussion with the Dean and Vice Chancellor of the Czech Technical University and People from the Czech and the Slovak ISHM Chapters. 6. Multichip Module Interconnections and Assembly II. 7. Thick Film Interconnections and Metallurgical Interactions I. 8. Thick Film Interconnections and Metallurgical Interactions II. Subject Index.
Dimensions (Overall): 9.21 Inches (H) x 6.14 Inches (W) x .75 Inches (D)
Weight: 1.36 Pounds
Suggested Age: 22 Years and Up
Number of Pages: 316
Genre: Technology
Sub-Genre: Electronics
Series Title: NATO Science
Publisher: Kluwer Academic Publishers
Theme: General
Format: Hardcover
Author: George G Harman & Pavel Mach
Language: English
Street Date: August 31, 1998
TCIN: 1007031710
UPC: 9780792351399
Item Number (DPCI): 247-04-5724
Origin: Made in the USA or Imported
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Shipping details

Estimated ship dimensions: 0.75 inches length x 6.14 inches width x 9.21 inches height
Estimated ship weight: 1.36 pounds
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