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Physical and Technical Problems of Soi Structures and Devices - (NATO Science Partnership Sub-Series: 3:) by Jean-Pierre Colinge (Hardcover)

Physical and Technical Problems of Soi Structures and Devices - (NATO Science Partnership Sub-Series: 3:) by  Jean-Pierre Colinge (Hardcover) - 1 of 1
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About this item

Highlights

  • Preface.
  • Author(s): Jean-Pierre Colinge
  • 304 Pages
  • Technology, Electronics
  • Series Name: NATO Science Partnership Sub-Series: 3:

Description



Book Synopsis



Preface. Contributors. SOI materials: Low dose SIMOX for ULSI applications; A.J. Auberton-Hervé, et al. Why porous silicon for SOI? V.P. Bondarenko, A.M. Dorofeev. Defect engineering in SOI films prepared by zone-melting recrystallization; E.I. Givargizov, et al. Ion beam processing for SOI; W. Skorupa. Semi-insulating oxygen-doped silicon by low temperature chemical vapor deposition for SOI applications; J.C. Sturm, et al. Direct formation of thin film nitride structures by high intensity ion implantation of nitrogen into silicon; R. Yankov, F. Komarov. Stimulated technology for implanted SOI formation; V.G. Litovchenko, et al. Behaviour of oxygen and nitrogen atoms sequentially implanted into silicon; A.B. Danilin. SOI fabrication by silicon wafer bonding with the help of glass-layer fusion; N.I. Koshelev, et al. Crystallization of a-Si films on glasses by multipulse- excimer-laser technique; A.B. Limanov. Microzone laser recrystallized polysilicon layers on insulator; A.A. Druzhinin, et al. SOI materials characterization techniques: Electrical characterization techniques for SOI materials and devices; S. Christoloveanu. The defect structure of buried oxide layers in SIMOX and BESOI structures; A.G. Revesz, H.L. Hughes. IR study of buried layer structure on different stages of technology; V.G. Litovchenko, et al. Optical investigation of silicon implanted with high doses of oxygen and hydrogen ions; P.A. Aleksandrov, et al. Electrical properties of ZMR SOI structures: characterization techniques and experimental results; T.E. Rudenko et al. SOI Devices: Fabrication and characterisation of poly-Si TFTs on glass; S.D. Brotherton, et al. Hot carrier reliability of SOI structures; D.E. Ioannou. NovelTESC bipolar transistor approach for a thin-film SOI substrate; C.J. Patel, et al. Problems of radiation hardness of SOI structures and devices; A.N. Nazarov. Fabrication of SIMOX structures and ICs test elements; G.G. Voronin, et al. Low-frequency noise characterization of SOI depletion-mode p- MOSFETS; N.B. Lukyanchikova, et al. SOI circuits: SOI devices and circuits: an overview of potentials and problems; J.-P. Colinge. 1.2 &mgr; CMOS/SOI on porous silicon; V.P. Bondarenko, et al. SOI pressure sensors based on laser recrystallized polysilicon; V.A. Voronin, et al. Index.
Dimensions (Overall): 9.21 Inches (H) x 6.14 Inches (W) x .69 Inches (D)
Weight: 1.33 Pounds
Suggested Age: 22 Years and Up
Number of Pages: 304
Genre: Technology
Sub-Genre: Electronics
Series Title: NATO Science Partnership Sub-Series: 3:
Publisher: Kluwer Academic Publishers
Theme: Semiconductors
Format: Hardcover
Author: Jean-Pierre Colinge
Language: English
Street Date: June 30, 1995
TCIN: 1006472988
UPC: 9780792336006
Item Number (DPCI): 247-16-4085
Origin: Made in the USA or Imported
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Shipping details

Estimated ship dimensions: 0.69 inches length x 6.14 inches width x 9.21 inches height
Estimated ship weight: 1.33 pounds
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