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Vlsi-Soc: From Systems to Chips - (IFIP Advances in Information and Communication Technology) (Hardcover)

Vlsi-Soc: From Systems to Chips - (IFIP Advances in Information and Communication Technology) (Hardcover) - 1 of 1
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About this item

Highlights

  • This book contains extended and revised versions of the best papers that have been presented during the twelfth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD Conference.
  • Author(s): Manfred Glesner & Ricardo Reis & Leandro Indrusiak & Vincent Mooney & Hans Eveking
  • 314 Pages
  • Computers + Internet, Networking
  • Series Name: IFIP Advances in Information and Communication Technology

Description



Book Synopsis



This book contains extended and revised versions of the best papers that have been presented during the twelfth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD Conference. The 12* edition was held at the Lufthansa Training Center in Seeheim-Jugenheim, south of Darmstadt, Germany (December 1-3, 2003). Previous conferences have taken place in Edinburgh (81), Trondheim (83), Tokyo (85), Vancouver (87), Munich (89), Edinburgh (91), Grenoble (93), Tokyo (95), Gramado (97), Lisbon (99)andMontpellier(01). The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show research results in the field of microelectronics design. The current trend toward increasing chip integration brings about exhilarating new challenges both at the physical and system-design levels: this conference aims to address these exciting new issues. The 2003 edition of VLSI-SoC conserved the traditional structure, which has been successful in previous editions. The quality of submissions (142 papers) made the selection process difficult, but finally 57 papers and 14 posters were accepted for presentation in VLSI-SoC 2003. Submissions came from Austria, Bulgaria, Brazil, Canada, Egypt, England, Estonia, Finland, France, Germany, Greece, Hungary, India, Iran, Israel, Italy, Japan, Korea, Malaysia, Mexico, Netherlands, Poland, Portugal, Romania, Spain, Sweden, Taiwan and the United States of America. From 57 papers presented at the conference, 18 were selected to have an extended and revised version included in this book.



From the Back Cover



International Federation for Information Processing

The IFIP series publishes state-of-the-art results in the sciences and technologies of information and communication. The scope of the series includes: foundations of computer science; software theory and practice; education; computer applications in technology; communication systems; systems modeling and optimization; information systems; computers and society; computer systems technology; security and protection in information processing systems; artificial intelligence; and human-computer interaction. Proceedings and post-proceedings of referred international conferences in computer science and interdisciplinary fields are featured. These results often precede journal publication and represent the most current research. The principal aim of the IFIP series is to encourage education and the dissemination and exchange of information about all aspects of computing.

For more information about the 300 other books in the IFIP series, please visit www.springeronline.com.

For more information about IFIP, please visit www.ifip.org.

Dimensions (Overall): 9.3 Inches (H) x 6.2 Inches (W) x 1.0 Inches (D)
Weight: 1.45 Pounds
Suggested Age: 22 Years and Up
Number of Pages: 314
Genre: Computers + Internet
Sub-Genre: Networking
Series Title: IFIP Advances in Information and Communication Technology
Publisher: Springer
Theme: General
Format: Hardcover
Author: Manfred Glesner & Ricardo Reis & Leandro Indrusiak & Vincent Mooney & Hans Eveking
Language: English
Street Date: May 17, 2006
TCIN: 1006378193
UPC: 9780387334028
Item Number (DPCI): 247-09-1410
Origin: Made in the USA or Imported

Shipping details

Estimated ship dimensions: 1 inches length x 6.2 inches width x 9.3 inches height
Estimated ship weight: 1.45 pounds
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