Artificial Plasmonics for VLSI Interconnects - by Soumitra R Joy (Hardcover)

About the Book

"This highlights the urgent need to examine the physics of power dissipation and innovate device materials to significantly cut energy consumption and ensure a sustainable computing future. A significant portion of this power consumption and heat generation comes from servers of datacenters, which include processors, memory, and interconnects. About 20% of a server's power usage is due to interconnects and switches. High-density interconnects in packagelevel integrations are especially power-intensive due to high parasitics, causing excessive power loss, signal delay, distortion, and crosstalk."-- Provided by publisher.

Book Synopsis

Build the microchips of the future with this revolutionary new information transfer technology

Advancements in high-performance computing have continually demanded for progresses in disruptive technological research and innovations. Moore's Law has pushed the Very Large Scale Integration (VLSI) technology to pack MOS devices inside a chip at an exponential rate, thereby surpassing now eight billion transistors per cm2. This has concomitantly fueled the growth of multilayered on-chip interconnects comprising metallic and low dielectric materials.

VLSI Interconnect Technology with Artificial Plasmonics introduces a new method for improving chip performance by harnessing the power of information transfer among chips at terahertz frequency. This revolutionary new electromagnetic wave engineering, called a spoof surface plasmon polariton, adapts the principles of VLSI and terahertz interconnect technology along with the artificial plasmonics to transfer huge quantities of data at vastly improved speeds. It constitutes a potentially decisive contribution to the pursuit of faster and more capacious VLSI chips.

In VLSI Interconnect Technology with Artificial Plasmonics, readers will also find:

• A cutting-edge new approach supported by pioneering research
• Detailed discussion of essential components related to the development of THz interconnect technology, including theory, modeling, simulation, and validation
• Roadmap to future technological development in the branch of artificial plasmonics

VLSI Interconnect Technology with Artificial Plasmonics is ideal for engineers, researchers, and scientists working in electronics, electromagnetics, and optics.

About the Author

Soumitra R. Joy is an Assistant Professor in the Department of Electrical and Computer Engineering at the University of North Carolina at Charlotte, USA. Before joining academia, he served as a device reliability engineer at Intel Corporation for four years. He earned his Ph.D. in Electrical Engineering from the University of Michigan, Ann Arbor, MI, USA, and is recognized for his research in artificial plasmonics and semiconductor devices.

Pinaki Mazumder, PhD, is a Professor in the Department of Electrical Engineering and Computer Science at the University of Michigan, Ann Arbor, MI, USA. He is a Fellow of both the IEEE and AAAS and internationally recognized for his research in the diverse aspects of VLSI circuits and systemsdesign