Encapsulation Technologies for Electronic Applications - (Materials and Processes for Electronic Applications) 2nd Edition (Paperback)

Book Synopsis

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages.

In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology.

Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic.

Review Quotes

"Microelectronics packaging engineers will find this book to be a useful reference for various material properties. Those wanting to learn about electronics packaging could use this book to learn about packaging fundamentals and state-of-the-art in encapsulation for microelectronics." --IEEE Electrical Insulation Magazine

"This book describes encapsulants and packaging processes commonly used in the electronic industry. Electronic and microelectronic industry professionals, working in packaging areas will find this book to be a good source for up-to-date information on various process, testing, and quality assurance methods in the microelectronic packaging world." --IEEE Electrical Insulation Magazine

About the Author

Dr. Haleh Ardebili has a BS honors degree in Engineering Science and Mechanics from Pennsylvania State University at University Park, MS degree in Mechanical Engineering from Johns Hopkins University and PhD degree in Mechanical Engineering from University of Maryland at College Park. She has three years of industry experience as research scientist at General Electric Global Research Center at Niskayuna, New York. She is a recipient of GE Invention Fulcrum of Progress Award. She has several years of experience teaching engineering courses at University of Houston. In Sep 2010, she joined as Assistant Professor in the Mechanical Engineering Department at University of Houston. Her research work is mainly focused on nanomaterials for Energy Storage and Electronics.